Dynamic thermal management for integrated circuits

The present invention provides for dynamic thermal management of integrated circuits, including memory modules, within a computer system. The thermal management methodology described herein closely couples software operation to hardware operation of the computer system, and allows each system to run...

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Bibliographische Detailangaben
Hauptverfasser:	POLLARD, II LLOYD L, GUPTE NITIN B
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE COMPUTING CONTROLLING COUNTING ELECTRIC DIGITAL DATA PROCESSING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PHYSICS REGULATING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	The present invention provides for dynamic thermal management of integrated circuits, including memory modules, within a computer system. The thermal management methodology described herein closely couples software operation to hardware operation of the computer system, and allows each system to run at near optimum performance levels without exceeding specified maximum temperature thresholds. In order to achieve such results, the present invention relates physical characteristics of the integrated circuit with physical characteristics of the internal chassis environment, and translates this relationship into a maximum software performance setting. The system monitors and adjusts software performance such that the maximum performance setting is not exceeded.