EMI filter terminal assembly with wire bond pads for human implant applications

An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via...

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Bibliographische Detailangaben
Hauptverfasser: FRYSZ CHRISTINE, KNAPPEN SCOTT, STEVENSON RYAN A, STEVENSON ROBERT A, BRENDEL RICHARD L, HUSSEIN HAYTHAM
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.