Strip conductor arrangement and method for producing a strip conductor arrangement

An interconnect arrangement comprises a substrate made from a first insulating material with a substrate surface, at least two interconnects which are arranged next to one another in the substrate, a buffer layer made from a second insulating material above the substrate and comprising a buffer-laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SCHINDLER GUENTHER, PAMLER WERNER, GABRIC ZVONIMIR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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