Jet nozzle structure for soldering apparatus

A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solder, an opening rim at a top of the...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUURA NOBUHIRO, YAMAGUCHI KAORU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solder, an opening rim at a top of the tubular body forming a top opening to expose the molten solder for soldering electronic components placed on a specified local area of the substrate, and one or more flow openings which are established on a side wall of the tubular body at a position lower than the opening rim by a predetermined distance.