Multi-chip package having spacer that is inserted between chips and manufacturing method thereof

A multi-chip package includes a substrate with a chip mounting area and a first chip positioned in the mounting area. A spacer is attached to the active surface of the first chip and has a thickness to allow space for wire-bonding the first chip's active surface to the substrate. A second chip is attached to the spacer over the first chip. Conductive metal wires electrically connect the first and second chips to the substrate. A package body is formed by encapsulating the first and second chips and the conductive metal wires. Ends of the spacer extend to the edge the package body. External connection terminals are attached to the bottom surface of the substrate and a method for the manufacturing thereof.