Concurrent electrical signal wiring optimization for an electronic package

The present invention relates to a method for optimization of a signal wire structure, providing concurrent optimization of a plurality of wire parameters, providing a plurality of wiring solutions, wherein each of said wiring solutions produces a wiring package having different wire parameters, pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BUDELL TIMOTHY W, AUDET JEAN, BUFFET PATRICK H, CARON ALAIN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a method for optimization of a signal wire structure, providing concurrent optimization of a plurality of wire parameters, providing a plurality of wiring solutions, wherein each of said wiring solutions produces a wiring package having different wire parameters, providing an electronic package, determining the optimal wiring solutions for said electronic package; and producing an electronic package, using the optimized wiring package solutions. The resulting apparatus is also disclosed.