Heat dissipating apparatus

A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is...

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Bibliographische Detailangaben
Hauptverfasser:	CHUNG CHAO-TSAI, HSIAO WANIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.