Anchor for device package

An anchor to hold getter materials in place within a micromechanical device package substrate. First and second cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. The getter anchor may be formed in a substrate comprised of at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HOLTON JOYCE WONG, SMITH JACK C, FISHER EDWARD CARL, LIU JWEI WIEN, ROBBINS ROGER A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SELECTING RESONANT CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING TUNING RESONANT CIRCUITS
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Beschreibung
Zusammenfassung:	An anchor to hold getter materials in place within a micromechanical device package substrate. First and second cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. The getter anchor may be formed in a substrate comprised of at least three layers. The layers form a cavity in the substrate with a wide bottom portion-formed in the middle layer and a relatively narrower top portion-formed by the top layer. The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity.