Methods for shielding one or more circuit of a printed circuit board

Methods for forming a metal shield on a printed circuit board ( 10 ) include depositing a first layer of metal ( 41 ) on a substrate ( 22 ) of the printed circuit board ( 10 ), depositing a first layer of dielectric material ( 42 ) on the first layer of metal ( 41 ), printing one or more circuits (...

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Bibliographische Detailangaben
Hauptverfasser:	BARRETO JOAQUIN, ARLEDGE JOHN K, SWIRBEL THOMAS J, UNDERWOOD JEFFREY A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Methods for forming a metal shield on a printed circuit board ( 10 ) include depositing a first layer of metal ( 41 ) on a substrate ( 22 ) of the printed circuit board ( 10 ), depositing a first layer of dielectric material ( 42 ) on the first layer of metal ( 41 ), printing one or more circuits ( 21, 21' ) on the first dielectric layer ( 42 ), depositing a second layer of dielectric material ( 43 ) over the one or more printed circuits ( 21, 21' ), forming a trench-like opening ( 44 ) in the two layers of dielectric material ( 42, 43 ) surrounding the one or more printed circuits ( 21, 21' ) so that the metal of the first layer ( 41 ) is exposed by the trench-like opening ( 44 ), depositing a second layer of metal ( 27 ) on the second layer of dielectric material ( 43 ) such that the second layer of metal ( 27 ) plates the trench-like opening ( 44 ) and makes electrical contact with the first metal layer ( 41 ).