Method of assembling an interconnect device assembly

A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixtu...

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Hauptverfasser: WEISS ROBERT, ADVOCATE, JR. GERALD G, PERRY CHARLES HAMPTON, KRUG FRANCIS, O'CONNOR DANIEL, CURRY NORMAN D, LONG DAVID C
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.