Method and apparatus for placement of vias
Method and apparatus for placement of vias is described. More particularly, source power and ground vias are placed in partial response to locations where conductive lines cross over a reserved region. The reserved region is reserved for an embedded device, and is reserved in a layout database of a...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Method and apparatus for placement of vias is described. More particularly, source power and ground vias are placed in partial response to locations where conductive lines cross over a reserved region. The reserved region is reserved for an embedded device, and is reserved in a layout database of a host device. |
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