Spring contact probe device for electrical testing

The invention provides a unitary spring contact probe comprising a resilient spring section, a plunger section extending from a distal end of the resilient spring section for contacting a semiconductor device under test and a stopper projecting from the plunger section substantially transversely to an axial direction of the plunger section. There is also provided an apparatus for testing a semiconductor comprising a plurality of said unitary spring contact probes, one or more insulative guiding holders for mounting the spring contact probes, and a retainer mechanism coupled to the stoppers of the spring contact probes for securing the spring contact probes to the insulative guiding holders.