Blind hole termination of pin to pcb

Tails ( 20 ) projecting from an electrical component ( 12 ) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board ( 14 ) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KNAUB JOHN EDWARD, MICKIEVICZ SCOTT KEITH
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Tails ( 20 ) projecting from an electrical component ( 12 ) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board ( 14 ) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated in a first layer ( 31 ) that will become the topmost layer of the stack, to form a shallow well ( 70 ). The well is filled with a soldering composition ( 130 ). A tail ( 20 ) is projected downward into the soldering composition, and the soldering composition is heated to solder the tail to the hole plating.