Method and apparatus for the analysis of scratches on semiconductor wafers

For the analysis of scratches on semiconductor wafers, the semiconductor wafer surface is detected and a possible scratch position or a scratch course on the semiconductor surface is determined, in which case a parameter value identifying the scratch is determined from the scratch position and the s...

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Bibliographische Detailangaben
Hauptverfasser:	BRASACK INGO, BECKMANN MARCO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	For the analysis of scratches on semiconductor wafers, the semiconductor wafer surface is detected and a possible scratch position or a scratch course on the semiconductor surface is determined, in which case a parameter value identifying the scratch is determined from the scratch position and the scratch course and this parameter value that has been determined is correlated with comparison parameter values, which identify installation-specific scratch positions and scratch courses, in order to determine an installation causing the scratch.