Method for manufacturing semiconductor device
A method of manufacturing a semiconductor device capable of polishing evenly and separating the adjacent word lines by performing the flattening process using slurry with a doping material added during the polishing process.
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A method of manufacturing a semiconductor device capable of polishing evenly and separating the adjacent word lines by performing the flattening process using slurry with a doping material added during the polishing process. |
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