Apparatus for removing tiebars after molding of semiconductor chip

An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left between leads of the lead fr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUNAGA KENTA, MANABE HIDEKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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