Apparatus for removing tiebars after molding of semiconductor chip

An apparatus for removing tiebars of a lead frame after one or more semiconductor components have been encapsulated in a resin to form a package body includes first and second removing stations. The second removing station is provided for removing scraps that may be left between leads of the lead frame after the tiebars have been removed in the first removing station. In the second removing station, the lead frame is positioned on a die. A scrap-cutting punch is moved relative to the die so that projections of the punch are fitted into corresponding holes of the die, thereby pushing the scraps out of the leads and into the holes.