Wafer scribing method and wafer scribing device

The present invention relates to a scribing method for wafers ( 11 ), wherein a defined beam ( 12 ) is directed onto the wafer ( 11 ) by means of a beam generator means ( 10 ) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MAUTZ KARL E, MARX ECKHARD, PEITER MARTIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to a scribing method for wafers ( 11 ), wherein a defined beam ( 12 ) is directed onto the wafer ( 11 ) by means of a beam generator means ( 10 ) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount ( 31 ) and a beam generator means ( 10 ) by means of which at least one defined beam can be directed onto the wafer ( 11 ). The inventive method is distinguished by the by the further step of generating a first radiation pulse having a predeterminable energy density and used to create a comparatively deep pit ( 18 ) in the wafer ( 11 ). The inventive wafer scribing means is distinguished by the provision that a radiation pulse can be generated by means of which a comparatively deep pit ( 18 ) can be created in the wafer ( 11 ).