Electrical device
With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe...
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creator | NITZSCHKE MICHAEL SCHULTZ DIETMAR DOERRHOEFER STEFAN |
description | With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive. |
format | Patent |
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The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050614&DB=EPODOC&CC=US&NR=6905361B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050614&DB=EPODOC&CC=US&NR=6905361B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NITZSCHKE MICHAEL</creatorcontrib><creatorcontrib>SCHULTZ DIETMAR</creatorcontrib><creatorcontrib>DOERRHOEFER STEFAN</creatorcontrib><title>Electrical device</title><description>With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB0zUlNLinKTE7MUUhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwWaWBqbGZoZORsZEKAEAkjQfTg</recordid><startdate>20050614</startdate><enddate>20050614</enddate><creator>NITZSCHKE MICHAEL</creator><creator>SCHULTZ DIETMAR</creator><creator>DOERRHOEFER STEFAN</creator><scope>EVB</scope></search><sort><creationdate>20050614</creationdate><title>Electrical device</title><author>NITZSCHKE MICHAEL ; SCHULTZ DIETMAR ; DOERRHOEFER STEFAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6905361B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NITZSCHKE MICHAEL</creatorcontrib><creatorcontrib>SCHULTZ DIETMAR</creatorcontrib><creatorcontrib>DOERRHOEFER STEFAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NITZSCHKE MICHAEL</au><au>SCHULTZ DIETMAR</au><au>DOERRHOEFER STEFAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrical device</title><date>2005-06-14</date><risdate>2005</risdate><abstract>With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. 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language | eng |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Electrical device |
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