Electrical device

With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NITZSCHKE MICHAEL, SCHULTZ DIETMAR, DOERRHOEFER STEFAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.