Two-step electrical connector and method using high resistance path for electrostatic discharge

A method and corresponding structure for establishing an electrical interconnection is disclosed. There are at least two conductors in one embodiment. The first conductor is preferably a static dissipative material, while the second conductor may be of any conventional electrically conductive material (e.g., copper). These two conductors move relative to each other. More specifically, the first conductor is brought into contact with a device having a stored charged. After a certain amount of relative movement between the first and second conductors, and while the first conductor has remained in contact with the device to allow for dissipation of at least a portion of the charge therefrom, the second conductor is then brought into contact with the device.