COG-assembly and connecting material to be used therein
A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips ( 3 ) are held in direct connection with the corresponding electrodes on the substrate glass circuit board ( 1 ), utilizes a layer ( 5 ) of a connecting material for bonding and connecting the semiconductor chip ( 3 )...
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| creator | FUJIHIRA HIROYUKI TAKEICHI MOTOHIDE |
| description | A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips ( 3 ) are held in direct connection with the corresponding electrodes on the substrate glass circuit board ( 1 ), utilizes a layer ( 5 ) of a connecting material for bonding and connecting the semiconductor chip ( 3 ) with the substrate board ( 1 ). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer ( 5 ) and the chip ( 3 ) and between the binder layer ( 5 ) and the glass board ( 1 ), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component ( 6 ) containing a thermosetting resin and, on the other hand, electroconductive particles ( 7 ) and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%. |
| format | Patent |
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The connecting material can provide a reduced stress concentration at the boundaries between the binder layer ( 5 ) and the chip ( 3 ) and between the binder layer ( 5 ) and the glass board ( 1 ), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component ( 6 ) containing a thermosetting resin and, on the other hand, electroconductive particles ( 7 ) and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%.</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; ADVERTISING ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CRYPTOGRAPHY ; CURRENT COLLECTORS ; DISPLAY ; DISPLAYING ; DYES ; EDUCATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LABELS OR NAME-PLATES ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PHYSICS ; POLISHES ; PRINTED CIRCUITS ; SEALS ; SEMICONDUCTOR DEVICES ; SIGNS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050607&DB=EPODOC&CC=US&NR=6903463B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050607&DB=EPODOC&CC=US&NR=6903463B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIHIRA HIROYUKI</creatorcontrib><creatorcontrib>TAKEICHI MOTOHIDE</creatorcontrib><title>COG-assembly and connecting material to be used therein</title><description>A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips ( 3 ) are held in direct connection with the corresponding electrodes on the substrate glass circuit board ( 1 ), utilizes a layer ( 5 ) of a connecting material for bonding and connecting the semiconductor chip ( 3 ) with the substrate board ( 1 ). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer ( 5 ) and the chip ( 3 ) and between the binder layer ( 5 ) and the glass board ( 1 ), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component ( 6 ) containing a thermosetting resin and, on the other hand, electroconductive particles ( 7 ) and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>ADVERTISING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CRYPTOGRAPHY</subject><subject>CURRENT COLLECTORS</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>DYES</subject><subject>EDUCATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LABELS OR NAME-PLATES</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEALS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SIGNS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39nfXTSwuTs1NyqlUSMxLUUjOz8tLTS7JzEtXyE0sSS3KTMxRKMlXSEpVKC1OTVEoyUgtSs3M42FgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8aHBZpYGxiZmxk6GxkQoAQA5Zy0m</recordid><startdate>20050607</startdate><enddate>20050607</enddate><creator>FUJIHIRA HIROYUKI</creator><creator>TAKEICHI MOTOHIDE</creator><scope>EVB</scope></search><sort><creationdate>20050607</creationdate><title>COG-assembly and connecting material to be used therein</title><author>FUJIHIRA HIROYUKI ; TAKEICHI MOTOHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6903463B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>ADVERTISING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CRYPTOGRAPHY</topic><topic>CURRENT COLLECTORS</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>DYES</topic><topic>EDUCATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LABELS OR NAME-PLATES</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEALS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SIGNS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJIHIRA HIROYUKI</creatorcontrib><creatorcontrib>TAKEICHI MOTOHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJIHIRA HIROYUKI</au><au>TAKEICHI MOTOHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COG-assembly and connecting material to be used therein</title><date>2005-06-07</date><risdate>2005</risdate><abstract>A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips ( 3 ) are held in direct connection with the corresponding electrodes on the substrate glass circuit board ( 1 ), utilizes a layer ( 5 ) of a connecting material for bonding and connecting the semiconductor chip ( 3 ) with the substrate board ( 1 ). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer ( 5 ) and the chip ( 3 ) and between the binder layer ( 5 ) and the glass board ( 1 ), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component ( 6 ) containing a thermosetting resin and, on the other hand, electroconductive particles ( 7 ) and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CRYPTOGRAPHY CURRENT COLLECTORS DISPLAY DISPLAYING DYES EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES PRINTED CIRCUITS SEALS SEMICONDUCTOR DEVICES SIGNS USE OF MATERIALS AS ADHESIVES |
| title | COG-assembly and connecting material to be used therein |
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