COG-assembly and connecting material to be used therein

A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips ( 3 ) are held in direct connection with the corresponding electrodes on the substrate glass circuit board ( 1 ), utilizes a layer ( 5 ) of a connecting material for bonding and connecting the semiconductor chip ( 3 ) with the substrate board ( 1 ). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer ( 5 ) and the chip ( 3 ) and between the binder layer ( 5 ) and the glass board ( 1 ), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component ( 6 ) containing a thermosetting resin and, on the other hand, electroconductive particles ( 7 ) and has a characteristic feature that a tensile elongation percentage at 25° C., after having been cured, is at least 5%.