Insulated bond wire assembly for integrated circuits
An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without shorting. Because bond wires may be crossed, integrated circuit assemblies with crossing bond wires may not n...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An insulated bond wire to connect integrated circuits to each other or to substrates. Insulated bond wires may allow bond wires connecting integrated circuits and substrates to cross without shorting. Because bond wires may be crossed, integrated circuit assemblies with crossing bond wires may not need to be redesigned to avoid the wire crossings. In addition, insulated bond wires may also allow for closer spacing between bond wires due to reduced electronic interference between the wires. Closer spacing may allow for more input and output ports on an integrated circuit and thus increase its functionality. |
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