Thermal control apparatus for electronic systems

A thermal control apparatus using heat pipes. The thermal control apparatus includes a heat pipe having a hollow interior at least partially filled with a vaporizable liquid. The heat pipe further includes a threaded outer surface configured for coupling the heat pipe into an aperture having a threa...

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Bibliographische Detailangaben
1. Verfasser:	KIM DAVID K. J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A thermal control apparatus using heat pipes. The thermal control apparatus includes a heat pipe having a hollow interior at least partially filled with a vaporizable liquid. The heat pipe further includes a threaded outer surface configured for coupling the heat pipe into an aperture having a threaded inner surface. The threaded outer surface maybe an integral portion of the heat pipe, or may be implemented using a separate piece that coupled to the heat pipe. A thermal control apparatus using the heat pipes may be implemented with a heat spreader having one or more apertures, wherein each of the apertures includes a threaded inner surface. A heat pipe having a threaded outer surface may be positioned in one of the apertures. The thermal control apparatus may be mounted on a printed circuit board in the proximity of one or more electronic components.