Reduced copper lead frame for saw-singulated chip package

A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANDERSON WILLIAM M, SYED AHMER, BANCOD LUDOVICO E, FOGELSON HARRY J, DELA CRUZ GREGORIO G, PALASI PRIMITIVO A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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