Reduced copper lead frame for saw-singulated chip package

A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and extending toward the die pad in spaced relation to each other are a plurality of leads. The outer frames are integrally connected to each other such that the lead frames are arranged in a matrix wherein the leads thereof extend in multiple rows and columns. The leads of the lead frames within each of the rows and columns are arranged in sets which are disposed in spaced relation to each other. A plurality of openings are formed within the strip between and in alignment with the leads of each of the lead frames within each of the rows and columns. The leads of each of the lead frames within each of the rows and columns and the openings collectively define saw streets for cutting the strip in a manner separating the lead frames from each other.