Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film

a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by di...

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Bibliographische Detailangaben
Hauptverfasser: YAMADA KINJI, NISHIKAWA MICHINORI, OKADA TAKASHI, SINOHARA NORIYASU, SHIRATO KAORI, EBISAWA MASAHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by dissolving the polymer having specific repeating units in a solvent has excellent film-forming properties. The polymer has repeating units represented by the following general formula (1): wherein Z and Y are as defined hereinabove.