Method for forming an electrical structure

Method for forming an electrical structure

A method for forming an electrical structure. A substrate and a compliant layer are provided. A plated through hole (PTH) is formed through the compliant layer. A top pad is formed on a top surface of the compliant layer, wherein the top pad is electrically coupled to the PTH. A bottom pad is formed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KRESGE JOHN S, MARKOVICH VOYA R
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for forming an electrical structure. A substrate and a compliant layer are provided. A plated through hole (PTH) is formed through the compliant layer. A top pad is formed on a top surface of the compliant layer, wherein the top pad is electrically coupled to the PTH. A bottom pad is formed on a bottom surface of the compliant layer, wherein the bottom pad is electrically coupled to the PTH. A mask layer is applied to the bottom surface of the compliant layer, wherein the mask layer covers the bottom pad and an end of the PTH. The compliant layer is joined with the substrate, mechanically and electrically at the top pad. The portion of the mask layer is removed, wherein a portion of the bottom pad is exposed.