Semiconductor devices and methods of making the devices

Semiconductor devices and methods of making the devices

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mo...

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Bibliographische Detailangaben
Hauptverfasser: KITANO MAKOTO, OTSUKA KENICHI, OOJI KAZUYA, HONDA MICHIHARU, EGUCHI SHUJI, NISHI KUNIHIKO, YONEDA NAE, ANJOH ICHIRO, SAEKI JUNICHI, YOSHIDA ISAMU, TSUNODA SHIGEHARU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.