Measurement of components that have been micro-galvanically produced, using a sample component by means of photoresist webs

A method for measuring microgalvanically produced components having a three-dimensional, depth-lithographically produced structure, which provides a single- or multilayer component which is constructed using galvanic metal deposition, the metal being deposited around a structure of photoresist defin...

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Bibliographische Detailangaben
1. Verfasser:	DANTES GUENTER
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BLASTING CHEMISTRY CINEMATOGRAPHY COMBUSTION ENGINES ELECTROFORMING ELECTROGRAPHY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HEATING HOLOGRAPHY HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS LIGHTING MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MECHANICAL ENGINEERING METALLURGY NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL SUPPLYING COMBUSTION ENGINES IN GENERAL, WITH COMBUSTIBLEMIXTURES OR CONSTITUENTS THEREOF TESTING TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	A method for measuring microgalvanically produced components having a three-dimensional, depth-lithographically produced structure, which provides a single- or multilayer component which is constructed using galvanic metal deposition, the metal being deposited around a structure of photoresist defining the desired orifice contour of the component; in the process, a photoresist region, which selectively interrupts the structure of the component to be manufactured, being incorporated during the microgalvanic production; at least the interrupting photoresist region being dissolved out of the interrupted component; and a contactless measuring of the orifice structure of the interrupted component being undertaken in the region of a previously existing resist edge of the photoresist region using a measuring device.