Multi-format connector module incorporating chip mounted optical sub-assembly

Embodiments of the invention include an optical connector module (OCM) electrically and optically connecting an integrated opto-electric assembly to standard format electrical and optical connectors. The OCM includes a module body that houses an integrated opto-electric assembly and provides electrical and optical connection to existing formats. The integrated opto-electric assembly comprising an optical sub-assembly (OSA) and chip sub-assembly (CSA) that are electrically connected to each other and configured as a single opto-electric component. The OCM includes an optical interface suitable for receiving an optical ferrule and configured to enable optical communication between optical fibers of the ferrule and the OSA. Additionally, the OCM includes an electrical interface suitable for electrically connecting the CSA to a standard format electrical connector. The OCM is configured such that it is compatible with optical ferrule formats and electrically compatible with electrical formats. The embodiments of the invention further include methods for electrically and optically interconnecting an integrated opto-electric assembly with standard format optical and electrical connectors.