Thermoformable polyamides

A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 sis greater than 1000 Pas and a shear velocity of 1000 sis less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly sui...

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Bibliographische Detailangaben
Hauptverfasser:	POPHUSEN DIRK, JOACHIMI DETLEV, ROEHNER JUERGEN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 sis greater than 1000 Pas and a shear velocity of 1000 sis less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.