Method for creating radial profiles on a substrate

The present invention is directed to a method for depositing a radial profile of a target material onto a substrate. The method comprises directing one or more target materials toward a substrate, blocking some predetermined portion of the target material with at least a first shutter so that it doe...

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Bibliographische Detailangaben
Hauptverfasser:	RAMBERG C. ERIC, WANG YOUQI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMBINATORIAL CHEMISTRY DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIBRARIES, e.g. CHEMICAL LIBRARIES, IN SILICOLIBRARIES METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention is directed to a method for depositing a radial profile of a target material onto a substrate. The method comprises directing one or more target materials toward a substrate, blocking some predetermined portion of the target material with at least a first shutter so that it does not strike the substrate, and rotating the substrate relative to the first shutter while the target material is directed toward the substrate so that a radial profile is formed on the substrate. In on embodiment, the substrate is rotated, and the first shutter does not rotate. In another embodiment, the first shutter rotates and the substrate does not rotate. The method permits a radial thickness or composition gradient on the substrate to be formed. The method may also include using one or more contact masks placed on the substrate during the deposition in order to mask off particular portions of the substrate during the deposition process.