Heatsink assembly and method of manufacturing the same

A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive slug projects from the center of the folded fm members and the folded fin members are thermally coupled to the slug. A gas circulating system is disposed over the slug and fin members projecting from the first surface of the base. The sidewall of a fin may be provided with at least one aperture. The top surface of the fin is closed, thereby permitting the fin to operate as a plenum of sorts. The bottom of the troughs may also be closed. The fins/troughs act as a plenum. A method of producing the folded fin heatsink member is also described.