Use of reactive phenolic resins in the preparation of highly viscous self-adhesive compositions

Hot-melt pressure-sensitive adhesive based one or more non-thermoplastic elastomers, at least comprising 100 parts by mass of the non-thermoplastic elastomer(s), from 1 to 200 parts by mass of one or more tackifying resins, from 1 to 100 parts by mass of one or more reactive phenolic resins whose me...

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Bibliographische Detailangaben
Hauptverfasser: BURMEISTER AXEL, LEYDECKER HEIKO, STAEHR JOCHEN, KREFT CHRISTIAN, HANSEN SVEN
Format: Patent
Sprache:eng
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Zusammenfassung:Hot-melt pressure-sensitive adhesive based one or more non-thermoplastic elastomers, at least comprising 100 parts by mass of the non-thermoplastic elastomer(s), from 1 to 200 parts by mass of one or more tackifying resins, from 1 to 100 parts by mass of one or more reactive phenolic resins whose methylol content is from 1 to 20% by weight, based on the reactive phenolic resin, from 1 to 100 parts by mass of accelerator substances.