Premolded cavity IC package

A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of sa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOW WILLIAM LAP KEUNG, MCLELLAN NEIL, WONG HUGO CHI WAI, THAMBY LABEEB SADAK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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