Premolded cavity IC package

A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of sa...

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Bibliographische Detailangaben
Hauptverfasser: CHOW WILLIAM LAP KEUNG, MCLELLAN NEIL, WONG HUGO CHI WAI, THAMBY LABEEB SADAK
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of said package body to an exterior thereof; mounting a semiconductor die to said die attach pad; wire bonding various ones of said leads to said semiconductor die; adding a fill material for covering at least a surface of said interior portion of said leads; and mounting a lid on said package body for enclosing said die in said cavity of said package body.