Substrate for semiconductor packaging

A plastic or resin based substrate panel for use in semiconductor package is described. The substrate includes a matrix of conductive elements (e.g. conductive studs, balls or the like) which are held in place by a molding plastic material. The conductive elements form conductive vias through the substrate and have exposed top and bottom surfaces which serve as contacts or landing that may be used to electrically couple electrical devices to the substrate. The substrate panel may be populated with integrated circuits which in turn are electrically connected to the substrate, encapsulated and singulated to form a plurality of packaged integrated circuits.