Method and apparatus for processing an array of packaged semiconductor devices

The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSUI CHING MAN STANLEY, CURITO, JR. M. BILAN, CHOW LAP KEI ERIC
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DIAGNOSIS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MEDICAL OR VETERINARY SCIENCE SEMICONDUCTOR DEVICES SURGERY
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!