Method and apparatus for processing an array of packaged semiconductor devices

Method and apparatus for processing an array of packaged semiconductor devices

The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUI CHING MAN STANLEY, CURITO, JR. M. BILAN, CHOW LAP KEI ERIC
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DIAGNOSIS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
SEMICONDUCTOR DEVICES
SURGERY
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Beschreibung
Zusammenfassung:The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.