Heat dissipation apparatus

A heat dissipation apparatus is described. The heat dissipation apparatus is used in an electrical product, and especially in a notebook computer. The heat dissipation apparatus has two cooling fans, at least one heat pipe, and at least two heat dissipation fins. The first fan sucks cooling air from outside of the electrical product. The heat pipe coupling with a heat source transfers heat generated by the heat source to the heat dissipation fins. The first heat dissipation fin and the first fan remove part of the heat out of the electrical product. The second heat dissipation fin further connects with the heat source and the heat pipe to utilize the second fan to remove part of the heat exhausted by the first fan from the electrical product. The heat dissipation apparatus further comprises a third heat dissipation fin and a second heat pipe. The second heat pipe efficiently transfers the heat to each of the heat dissipation fins. The third heat dissipation fin is positioned in an outlet of the second fan to exchange heat again and thus enhance the heat dissipation efficiency.