Apparatus and method for controlling plating uniformity

The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition...

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Bibliographische Detailangaben
Hauptverfasser: KELLY JAMES J, WEST ALAN C, HACHMAN, JR. JOHN T
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel-sulfamate bath. The shield is shown to improve the average current density at a plating surface.