Bead curing finger mold

A tire bundle is molded in a mold cavity formed by closing a mold having upper and lower mold halves with intermeshing fingers (20, 24) for enclosing bead wires and providing a molded bead ring for placing in a bead apex mold.

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Bibliographische Detailangaben
Hauptverfasser:	WILSON BRIAN JOSEPH, REX WILLIAM ALLEN, CONGER KENNETH DEAN
Format:	Patent
Sprache:	eng
Schlagworte:	PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A tire bundle is molded in a mold cavity formed by closing a mold having upper and lower mold halves with intermeshing fingers (20, 24) for enclosing bead wires and providing a molded bead ring for placing in a bead apex mold.