Multichip module having chips on two sides

A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GIRI AJAY PRABHAKAR, SULLIVAN JOSEPH MICHAEL, TESSLER CHRISTOPHER LEE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin film structure with at least one semiconductor device on each of two opposed sides of the thin film structure. The thin film structure includes arrays of pads on opposed surfaces of the thin film structure for connecting the thin film structure to the semiconductor devices and the frame. The thin film structure further includes wiring for chip to chip connectivity and for connecting to the frame.