Multiple degree of freedom substrate manipulator

A system for manipulating a planar substrate such as a semiconductor wafer is provided. The manipulator is typically used in conjunction with an XY stage to focus and planarize a wafer with respect to a tool. The manipulator employs redundant actuators of different types and a control system that us...

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Bibliographische Detailangaben
1. Verfasser:	HUNTER BRADLEY L
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A system for manipulating a planar substrate such as a semiconductor wafer is provided. The manipulator is typically used in conjunction with an XY stage to focus and planarize a wafer with respect to a tool. The manipulator employs redundant actuators of different types and a control system that uses low-bandwidth, high efficiency actuators to provide low frequency forces and high-bandwidth, but less efficient, actuators to provide all other forces. The manipulator provides support and manipulation of a substrate while minimizing errors due to thermal distortion.