Package for enclosing a laser diode module

A laser diode (LD) module includes a base (20), a four contacts (21), (22), (23) and (24) and package sealing material (25). The base is made of a metal material has three through holes (203), and defines a channel (204) in a bottom side thereof and in communication with the through holes. The four...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HUANG NAN TSUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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