Package for enclosing a laser diode module

Package for enclosing a laser diode module

A laser diode (LD) module includes a base (20), a four contacts (21), (22), (23) and (24) and package sealing material (25). The base is made of a metal material has three through holes (203), and defines a channel (204) in a bottom side thereof and in communication with the through holes. The four...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HUANG NAN TSUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A laser diode (LD) module includes a base (20), a four contacts (21), (22), (23) and (24) and package sealing material (25). The base is made of a metal material has three through holes (203), and defines a channel (204) in a bottom side thereof and in communication with the through holes. The four contacts, one is soldered to the base, and the others three inserted through the three through holes. The insulative package sealing material is plastic inserted molded into the channel and connecting through holes to fix the three contacts in the base while preventing electrical connection between the base and the contacts.