Polishing pad with release layer

A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad replacement. The polishing pad includes a polishing layer, at least one sub-pad layer adjacent the polishing layer, and an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer. The at least one sub-pad layer may include a plurality of layers, such as at least one resilient layer, at least one rigid layer, and/or at least one layer that has both rigid and resilient characteristics. The release layer may be interposed between the polishing layer and the sub-pad or between adjacent layers of the sub-pad. Multiple release layers may be included that are interposed between the polishing layer and layers of the sub-pad, as desired. When the polishing layer and/or other sub-pad layers wear out and need to be replaced, the worn layers may be removed from the polishing pad at one or more release layers, leaving the non-worn layers of the sub-pad still attached to a polishing device. A new polishing layer with or without attached sub-pad layers may then be attached to the remaining sub-pad layers on the polishing device for continued polishing processes.