Substrate cleaning brush preparation sequence, method, and system

A method for cleaning top and bottom surfaces of a semiconductor substrate is provided. The method includes scrubbing top and bottom surfaces of the semiconductor wafer with top and bottom brushes, respectively. Top and bottom brushes are saturated and supplied with a scrubbing fluid. The top and bottom brushes are squeezed so as to press out excess scrubbing fluid by continuing to apply top and bottom brushes against top and bottom surfaces of the semiconductor substrate, respectively, but without supplying the scrubbing fluid. Top and bottom brushes are respectively moved away from the top and bottom surfaces of the semiconductor substrate. The top brush is rotated so as to prevent dripping onto the top surface of the semiconductor substrate. Top and bottom surfaces of the semiconductor substrate are rinsed using a rinse fluid while continuing to rotate the top brush that was squeezed to press out the excess scrubbing fluid.